Substrate transfer systems and methods of use thereof

ABSTRACT

Disclosed herein are systems and methods relating to a transfer chamber for an electronic device processing system. The transfer chamber can include a first magnetic levitation track having a face-up orientation and a second magnetic levitation track spaced from the first magnetic levitation track and having a face-down orientation. The system can include substrate carriers that move along the first and second magnetic levitation tracks where each substrate carrier includes a magnet on a bottom portion to interact with a first magnetic field and a second magnet on a top portion to interact with a second magnetic field. The system also can include at least one lift pin assembly to move the substrate carriers in a vertical direction between the first and second magnetic levitation tracks.

RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.16/825,450, filed 20 Mar. 2020, which is incorporated by referenceherein.

FIELD

The disclosure relates generally to the field of robotics and substratetransfer systems that transport substrates between chambers within anisolated environment. The substrates may be transported using a magneticlevitation platform within a transport enclosure. Also disclosed aremethods of use of such magnetic levitation platforms in a transferchamber.

BACKGROUND

Semiconductor devices are produced on semiconductor substrates usingnumerous process steps within several process chambers. Each processchamber is used to complete one or more of the various steps (e.g.,etching, polishing, depositions) to form the semiconductor devices.Substrate transfer systems are used to move the substrates between eachof the process chambers. The process chambers and the substrate transfersystem can each be held under vacuum. One arrangement used for substratetransfer systems is a linear arrangement where process chambers arearranged in rows along each side of a linear (rectangular) chamber.

A substrate transfer system using a linear arrangement typicallyincludes a conveyor having a rectangular top surface with processchambers on one side or opposing sides of the conveyor. The conveyor canbe connected to a load lock in order to maintain the vacuum environmentwithin the substrate transfer system when the substrates are suppliedand removed from the substrate transfer system. One or more robots canbe positioned near the process chambers to transfer the substratesbetween the conveyor and the process chambers. Conventional substratecarriers are typically limited to moving substrates in only onedirection. Accordingly, movement options for moving substrates betweenprocess chambers and to and/or from a load lock may be limited.Additionally, conventional substrate carriers may have a large footprintand internal volume to accommodate one track that moves in firstdirection and a horizontally offset second track that moves in anopposite second direction.

BRIEF SUMMARY

According to various embodiments, disclosed herein is a transfer chamberfor an electronic device processing system, comprising a first magneticlevitation track disposed at a first height within the transfer chamber,wherein the first magnetic levitation track has a face-up orientationconfigured to generate a first magnetic field above the first magneticlevitation track; a second magnetic levitation track disposed at asecond height within the transfer chamber, wherein the second magneticlevitation track has a face-down orientation configured to generate asecond magnetic field below the first magnetic levitation track; aplurality of substrate carriers configured to move along the firstmagnetic levitation track and the second magnetic levitation track,wherein each substrate carrier of the plurality of substrate carrierscomprises a first magnet on a bottom of the substrate carrier tointeract with the first magnetic field and a second magnet on a top ofthe substrate carrier to interact with the second magnetic field; and atleast one lift pin assembly configured to move the plurality ofsubstrate carriers in a vertical direction between the first magneticlevitation track and the second magnetic levitation track.

According to various embodiments, further disclosed herein is anelectronic device processing system, comprising a transfer chambercomprising a first magnetic levitation track disposed at a first heightwithin the transfer chamber, wherein the first magnetic levitation trackhas a face-up orientation configured to generate a first magnetic fieldabove the first magnetic levitation track; a second magnetic levitationtrack disposed at a second height within the transfer chamber, whereinthe second magnetic levitation track has a face-down orientationconfigured to generate a second magnetic field below the first magneticlevitation track; a plurality of substrate carriers configured to movealong the first magnetic levitation track and the second magneticlevitation track, wherein each substrate carrier of the plurality ofsubstrate carriers comprises a first magnet on a bottom of the substratecarrier to interact with the first magnetic field and a second magnet ona top of the substrate carrier to interact with the second magneticfield; and at least one lift pin assembly configured to move theplurality of substrate carriers in a vertical direction between thefirst magnetic levitation track and the second magnetic levitationtrack; a plurality of process chambers connected to the transfer chamberalong a length of the transfer chamber; and a first load lock connectedto an end of the transfer chamber.

In yet further various embodiments, disclosed herein is a method ofmoving one or more substrates in a transfer chamber, comprisingretrieving a first substrate from a load lock by a first substratecarrier engaged with a first magnetic levitation track positionedproximate to a bottom surface of the transfer chamber, wherein the firstmagnetic levitation track has a face-up orientation configured togenerate a first magnetic field above the first magnetic levitationtrack; generating the first magnetic field by the first magneticlevitation track to move the first substrate carrier with the firstsubstrate in a first direction along the first magnetic levitationtrack; lifting, with a first lift pin assembly, the first substratecarrier with the first substrate to a second magnetic levitation trackpositioned proximate to a top surface of the transfer chamber, whereinthe second magnetic levitation track has a face-down orientationconfigured to generate a second magnetic field below the first magneticlevitation track; detecting that the first substrate carrier isproximate to the second magnetic levitation track; and generating thesecond magnetic field to suspend the first substrate carrier below thesecond magnetic levitation track and to move the first substrate carrierwith the first substrate in a second opposite direction along the secondmagnetic levitation track.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings in which likereferences indicate similar elements.

FIG. 1A depicts a top view of a substrate transfer system according tovarious embodiments.

FIG. 1B depicts a side view of a substrate transfer system according tovarious embodiments.

FIG. 1C depicts a substrate carrier according to various embodiments.

FIG. 2 illustrates a method of moving a wafer through a transfer chamberaccording to various embodiments.

FIG. 3 illustrates a method of moving a wafer through a transfer chamberaccording to various embodiments.

FIG. 4 illustrates a method of moving a wafer through a transfer chamberaccording to various embodiments.

DETAILED DESCRIPTION

Reference throughout this specification to, for example, “oneembodiment,” “certain embodiments,” “one or more embodiments” or “anembodiment” means that a particular feature, structure, material, orcharacteristic described in connection with the embodiment is includedin at least one embodiment of the invention. Thus, the appearances ofthe phrases such as “in one or more embodiments,” “in certainembodiments,” “in one embodiment” or “in an embodiment” in variousplaces throughout this specification are not necessarily referring tothe same embodiment of the invention. Furthermore, the particularfeatures, structures, materials, or characteristics may be combined inany suitable manner in one or more embodiments.

As used herein, the singular forms “a,” “an,” and “the” include pluralreferences unless the context clearly indicates otherwise. Thus, forexample, reference to “a lift pin” includes a single lift pin as well asmore than one lift pin.

As used herein, the term “about” in connection with a measured quantity,refers to the normal variations in that measured quantity as expected byone of ordinary skill in the art in making the measurement andexercising a level of care commensurate with the objective ofmeasurement and the precision of the measuring equipment. In certainembodiments, the term “about” includes the recited number ±10%, suchthat “about 10” would include from 9 to 11.

The term “at least about” in connection with a measured quantity refersto the normal variations in the measured quantity, as expected by one ofordinary skill in the art in making the measurement and exercising alevel of care commensurate with the objective of measurement andprecisions of the measuring equipment and any quantities higher thanthat. In certain embodiments, the term “at least about” includes therecited number minus 10% and any quantity that is higher such that “atleast about 10” would include 9 and anything greater than 9. This termcan also be expressed as “about 10 or more.” Similarly, the term “lessthan about” typically includes the recited number plus 10% and anyquantity that is lower such that “less than about 10” would include 11and anything less than 11. This term can also be expressed as “about 10or less.”

Unless otherwise indicated, all parts and percentages are by weight.Weight percent (wt. %), if not otherwise indicated, is based on anentire composition free of any volatiles, that is, based on dry solidscontent.

According to embodiments, disclosed herein is a transfer chamber havinga bi-directional magnetic levitation platform for use in a semiconductordevice manufacturing system. In embodiments, the bi-directional magneticlevitation platform has a linear configuration with a narrow (e.g., notmuch wider than a wafer's diameter) internal width that can move wafersin either direction without breaking vacuum and that may provide randomaccess to process chambers connected to thereto. In embodiments, thesystem includes two magnetic levitation platforms, one at the top of thetransfer chamber and one at the bottom of the transfer chamber in afacing arrangement.

The bi-direction vacuum magnetic levitation platform not only has anarrow, small footprint (i.e., about the width of a wafer's diameter),but enables a flexible-wafer flow, eliminates the need to break vacuumduring wafer transport, has a small vacuum volume and is relatively easyto service. According to embodiments, the bi-directional magneticlevitation system as described herein is a single volume platform,optionally, without load-locks. The system enables random chamber accesson either forward or return magnetic levitation tracks.

In embodiments, the transfer system (also referred to as a transferchamber) has two magnetic levitation tracks. The top track is disposedat a top of the transfer chamber and oriented upside down with a surfacethat provides motive force (e.g., a stator of a linear motor) facingdown into the interior volume of the transfer chamber. The bottom trackis disposed at a bottom of the transfer chamber and oriented right sideup with a surface that provides motive force (e.g., a stator of anotherlinear motor) facing up into the interior volume of the transferchamber. The top track and the bottom track may each be or includestators of linear motors. The substrate carriers have two sets ofmagnets (or two movers of linear motors), one on top of another,arranged in a way so they do not short each other's magnetic fields. Onemover (e.g., one set of magnets) may be disposed on a top of eachsubstrate carrier, and one mover (e.g., one set of magnets) may bedisposed on a bottom of each substrate carrier. This arrangement enablesthe substrate carriers to be moved by the lower linear motor (e.g., andride the lower track) as well as be moved by the upper linear motor(e.g., and ride the upper track). Transition between tracks may beeffected by a series of lift pin assemblies that may be isolated fromatmosphere using bellows. Each lift pin assembly has a set of lift pinsthat can lift a substrate carrier (which may include a wafer attachedthereto, such as a wafer on an end effector of the substrate carrier)from the bottom track to the top track and/or lower the substratecarrier from the top track to the bottom track. When the substratecarrier with the wafer attached thereto reaches a certain proximity tothe top magnetic levitation track (e.g., sensed by a track sensingsystem), the top track may activate a magnetic field in the proximity ofthe substrate carrier, securing the substrate carrier to the top track.The bottom track may be configured to move substrate carriers in a firstdirection, and the top track may be configured to move substratecarriers in an opposite second direction. Accordingly, the substratecarriers and supported substrates can freely move in both directions toa destination point without causing collisions between substratecarriers and with minimal internal volume of the transfer chamber and aminimal footprint of the transfer chamber.

The bi-directional magnetic levitation system can include a plurality oflift pin assemblies, so the substrate carrier can transit to and fromthe top track at several locations. This enables a wafer, for example,to be moved in a first direction from a load lock to chamber #2 via thebottom track, processed in chamber #2, transferred in the firstdirection to chamber #4 via the bottom track, processed in chamber #4,transferred in a second direction back to chamber #3 via the top track,processed in chamber #3, and moved in the second direction back to theload lock via the top track.

According to embodiments, described herein are transfer chambers forelectronic device processing systems, comprising a first magneticlevitation track disposed at a first height within the transfer chamber,wherein the first magnetic levitation track has a face-up orientationconfigured to generate a first magnetic field above the first magneticlevitation track; a second magnetic levitation track disposed at asecond height within the transfer chamber, wherein the second magneticlevitation track has a face-down orientation configured to generate asecond magnetic field below the second magnetic levitation track; aplurality of substrate carriers configured to move along the firstmagnetic levitation track and the second magnetic levitation track,wherein each substrate carrier of the plurality of substrate carrierscomprises a first magnet on a bottom of the substrate carrier tointeract with the first magnetic field and a second magnet on a top ofthe substrate carrier to interact with the second magnetic field; and atleast one lift pin assembly configured to move the plurality ofsubstrate carriers in a vertical direction between the first magneticlevitation track and the second magnetic levitation track. According toembodiments, the first magnet on the bottom of the substrate carrier canbe a magnet system comprising, for example, a plurality of magnetsarranged in a Hallbach array so that they do not impact operation of theother magnet system. The first magnet (system) can be in a right-side-uporientation. The second magnet on the top of the substrate carrier canbe a second magnet system also comprising, for example, a plurality ofmagnets arranged in a Hallbach array so that they do not impactoperation of the other magnet system. The second magnet (system) can beoriented in an upside down configuration.

Arranging the first and second magnetic levitation tracks in a facingconfiguration reduces the footprint of the transfer chamber as well asthe interior volume of the transfer chamber that is pumped down tovacuum. Additionally, according to embodiments, all of the electronicsof the transfer chamber can be positioned on the atmospheric side of thetransfer chamber. According to embodiments, the transfer chamber may notcomprise an elevator. Rather, the transfer chamber may comprise aplurality of lift pin assemblies that can move the substrate carriers(and supported substrates such as wafers) between the first and secondmagnetic levitation tracks at various points along the transfer chamber.In further embodiments, the substrate carrier comprises two sets ofmagnets that allow it to travel along first and second tracks withoutflipping over.

Referring to FIG. 1A, a transfer chamber 102, for an electronic deviceprocessing system 100, can have at least one port 103 configured topermit access to at least one process chamber 104. In embodiments, thetransfer chamber 102 can have a plurality of ports 103, 103A-103K whereeach of the ports is configured to permit access to one of a pluralityof process chambers 104, 104A-104K. Each port may include a slit valvethat is sized to receive an end effector holding a substrate (e.g., awafer). In one embodiment, all of the ports 103, 103A-K and/or slitvalves are co-planar and share a common height. Alternatively, differentports and/or slit valves may be positioned at different heights and/orplanes. Additionally, in one embodiment, all ports 103, 103A-K and/orslit valves have a common opening pitch (vertical dimension of theopening). The common opening pitch may be a single height pitch that canreceive an end effector and substrate positioned at a specific height ora multi-height pitch that can receive end effectors and substratespositioned at multiple different heights (e.g., end effectors andsubstrates of substrate carriers attached to a bottom track as well asend effectors and substrates of substrate carriers attached to a toptrack). Alternatively, different ports 103, 103A-K may have differentopening pitches.

According to embodiments, the transfer chamber can have a length and awidth, where a first dimension of the length is orders of magnitudegreater than a second dimension of the width. The plurality of ports103, 103A-103K can be disposed along the length of the transfer chamber102. In embodiments, the ports 103, 103A-K may be oriented approximatelyorthogonal to the length of the transfer chamber 102. In embodiments,the length is about 5 ft to about 20 ft, or about 6 ft, or about 8 ft,or about 10 ft, or about 12 ft, or about 14 ft, or about 16 ft, or about18 ft, or about 20 ft, and so on. In embodiments, the transfer chamber102 can further include an additional port 106 configured to permitaccess to a load lock 107 (or multiple additional ports each configuredto permit access to one or more load locks). The additional port 106 canbe disposed at a first end of the transfer chamber 102 along the widthof the transfer chamber 102. The load lock 107 may be connected to afactory interface 109 containing one or more front opening unified pods(FOUPs) 111. The factory interface contains a robot (not shown) thattakes wafers from the FOUPs 111 and places them in the load lock 107 forthe substrate carriers 110, 110A-C to retrieve them from the load lock107.

In some embodiments, the first port may be approximately orthogonal toports 103, 103A-K. In embodiments, the width of the transfer chamber 100is approximately equal to the width of the load lock 107 or the width ofa substrate 108, 108A-108C. In embodiments, the width of the transferchamber 100 is about 2 mm to about 20 mm wider than the load lock 107and/or a substrate 108, 108A-108C.

The transfer chamber system 100 includes at least one substrate carrier110, 110A-110C configured to transfer a substrate 108, 108A-108C betweenthe at least one process chamber 104, 104A-104K and the transfer chamber102. According to embodiments, the transfer chamber 102 can containseveral substrate carriers 110, 110A-110C, for example, 2, 3, 4, 5, 6,7, 8, 9 or 10, or about 2 to about 10 substrate carriers.

Each substrate carrier 110, 110A-110C is configured to move using amagnetic levitation conveyor system (e.g., one or more linear motors).For example, each substrate carrier 110, 110A-110C can move along atleast one magnetic levitation track 112, 114 as shown in FIG. 1B.According to embodiments, the transfer chamber 102 can include twomagnetic levitation tracks 112, 114, a first magnetic levitation track112 (e.g., a first stator of a linear motor) on a bottom interiorsurface 116 of the transfer chamber 102 and a second magnetic levitationtrack 114 (e.g., a second stator of another linear motor) on anopposite, top interior surface 118 of the transfer chamber 102. Thefirst magnetic levitation track 112 can be configured to move substratecarriers 110, 110A-C in a forward direction (away from the load lock)while the second magnetic levitation track 114 can be configured to movesubstrate carriers 110, 110A-C in an opposite, reverse direction. Inembodiments (not shown), the first magnetic levitation track 112 can beon the bottom interior surface 116 while the second magnetic levitationtrack 114 can be on the top interior surface 118. The magneticlevitation tracks 112, 114 can be in a facing arrangement (e.g., withthe first magnetic levitation track 112 in a face-up orientation and thesecond magnetic levitation track 114 in a face-down orientation) asshown in FIG. 1B. In embodiments, the first track 112 and the secondtrack 114 may be spaced apart by a distance of about 40 mm to about 300mm, or about 100 mm to about 250 mm, or about 150 mm to about 200 mm.

According to embodiments, the first magnetic levitation track 112 can beconfigured to move one or more of a plurality of substrate carriers 110,110A-110C in a first direction along the length of the transfer chamber102. The second magnetic levitation track 114 can be configured to moveone or more of the plurality of substrate carriers 110, 110A-110C in asecond direction along the length of the transfer chamber 102, whereinthe second direction is opposite the first direction. For example, thefirst magnetic levitation track 112 may move substrate carriers 110,110A-110C from a load lock 106, into the transfer chamber 102 and into aprocess chamber 104, 104A-104K. Correspondingly, the top magneticlevitation track 114 may move substrate carriers 110, 110A-110C from aprocess chamber 104, 104A-104K, through the transfer chamber 102 and tothe load lock 106. In embodiments, the transfer chamber system caninclude at least one position sensor for monitoring a position of thesubstrate carriers 110, 110A-110C. In one embodiment, the first andsecond magnetic levitation tracks 112, 114 may include a position sensorfunctionality.

FIG. 1C shows an embodiment of a substrate carrier 110 suitable for usein the transfer chamber system 100 according to embodiments. Thesubstrate carrier 110 can include an end effector 120 for receiving,lifting and holding a substrate 108, such as a wafer, and/or on which asubstrate may be placed. Any suitable end effector 120 for use in asemiconductor processing system can be used as would be understood bythose of ordinary skill in the art. According to embodiments, the one ormore substrate carrier 110 can be a robot arm as known to those ofordinary skill in the art. The substrate carrier 110 can include anupper magnetic portion 124 and a lower magnetic portion 126. The lowermagnetic portion 126 may be, for example, a first mover of a firstlinear motor. The upper magnetic portion 124 may be, for example, asecond mover of a second linear motor. Alternatively, the upper magneticportion and the lower magnetic portion may be upper and lower halves ofa single mover that is configured to engage with a first stator belowthe substrate carrier 110 and a second stator above the substratecarrier 110. The upper magnetic portion 124 may include one or moremagnets (e.g., permanent magnets), and the lower magnetic portion 126may include one or more additional magnets. The upper and lower magneticportions may be configured such that their magnetic fields do notinterfere with one another. The magnetic levitation conveyor systemincludes one or more electromagnets (not shown) for controlling movementof the substrate carriers and linear motors (not shown) for moving thesubstrate carriers 110, 110A-110C.

Referring back to FIGS. 1A-1B, according to embodiments, the pluralityof ports 103, 103A-103K can be or include a plurality of slit valves. Afirst transfer plane of at least a first subset of the plurality of slitvalves is accessible to the substrate carriers 110C engaged with thefirst magnetic levitation track 112. A second transfer plane of a secondsubset of the plurality of slit valves can be accessible to substratecarriers 110A, 110B engaged with the second magnetic levitation track114. To further improve throughput and enable approximately simultaneousswapping of substrates in a process chamber 104, 104A-104K or load lock107, at least some of the plurality of slit valves have a first wafertransfer plane and a second wafer transfer plane that is above the firstwafer transfer plane. The first wafer transfer plane can be accessibleto substrate carriers 110C that are engaged with the first magneticlevitation track 112. The second wafer transfer plane can be accessibleto substrate carriers 110A, 110B that are engaged with the secondmagnetic levitation track. For example, a first substrate carrier 110Cengaged with the first magnetic levitation track 112 can enter a processchamber 104, 104A-104K while a second substrate carrier 110A, 110Bengaged with the second magnetic levitation track 114 and holding asubstrate thereon 108, 108A-108C can be positioned above the firstsubstrate carrier 110C. Once (or while) the first substrate is removedfrom the process chamber in the first transfer plane, the secondsubstrate can be loaded into the same process chamber in a secondtransfer plane completing a swap of the first substrate (e.g., whichjust finished processing) and the second substrate (e.g., which requiresprocessing). In further embodiments, the plurality of slit valves canhave a common transfer plane accessible to substrate carriers 110,110A-110C that are engaged with the first magnetic levitation track 112as well as to substrate carriers 110, 110A-110C that are engaged withthe second magnetic levitation track 114. The slit valve openings can besized according to the configuration of the transfer planes. The slitvalve opening may be about 1 inch to about 20 inches for a singletransfer plane and about 2 inches to about 20 inches when there are twotransfer planes. For example, if there are two wafer transfer planes,the slit valve opening may be larger than if there is one wafer transferplane.

According to embodiments, the system can include a first load lock 107and a second load lock (not shown). The first load lock 107 can beaccessible to substrate carriers 110, 110C that are engaged with thefirst magnetic levitation track. The second load lock can be stackedabove the first load lock 107 at the end of the transfer chamber 102.The second load lock can be accessible to substrate carriers 110A, 110Bthat are engaged with the second magnetic levitation track. Inembodiments, a first height of the transfer chamber 102 at the end nearthe first load lock 107 can be greater than a second height of aremainder of the transfer chamber 102. In further embodiments, the firstload lock 107 and the second load lock can be arranged in a side-by-sideconfiguration at an angle relative to the length of the transfer chamber(e.g., a 30 or 45 degree angle).

According to embodiments, the system includes at least one lift pinassembly 128, 128A-128C configured to receive a substrate 108, 108A-108Cand to lift and/or lower the substrate between transfer planes and/orbetween magnetic levitation tracks 112, 114. The lift pin assembly 128,128A-128C can include one or more lift pins, for example, a pair or trioof lift pins 130, 130A-130C. The lift pins 130, 130A-130C can beconfigured to pass through the bottom surface 116 of the transferchamber 102 and may have an atmospheric-facing side and a vacuum-facingside. The atmospheric-facing side can be outside of the bottom surfaceof the transfer chamber 102. The lift pins 130, 130A-130C may beenclosed in a bellows to maintain the vacuum environment in the transferchamber. The lift pins 130, 130A-130C can be configured to extend intothe transfer chamber 102 on the vacuum-facing side. In embodiments, theat least one lift pin assembly 128, 128A-128C can be configured to movea substrate carrier 110 that is positioned in front of the first loadlock 107 in a vertical direction to cause the substrate carrier 110 toreach a transfer plane above the second height of the remainder of thetransfer chamber 102 (discussed above). During operation, when a liftpin 130, 130A-130C lifts a substrate carrier 110, 110A-110C to a certainproximity with the top track 118, a magnetic field can be activated inthe proximity of a substrate carrier. The magnetic field in theproximity of the substrate carrier 110, 110A-110C can be deactivatedwhen a lift pin 130, 130A-130C engages with the substrate carrier 110,110A-110C on the top track 118 to move the substrate to the lower track112 via the lift pin 130, 130A-130C.

Further described herein are methods of using a transfer chamber systemaccording to various embodiments. Referring to FIG. 2 , the method 200can include at block 202 moving a first substrate through a transferchamber. The moving 202 can include at block 204 receiving the firstsubstrate by a first substrate carrier, wherein the first substratecarrier is associated with a first magnetic levitation track positionedon a bottom surface of the transfer chamber. In embodiments, thereceiving 204 can include moving an end effector of the substratecarrier into a semiconductor process chamber associated with thetransfer chamber and receiving the first substrate on the end effector.

The moving 202 further can include, optionally, at block 206 moving thefirst substrate carrier with the first substrate along the firstmagnetic levitation track. Additionally or alternatively, the moving 202further can include, optionally, at block 208 lifting with a first liftpin assembly the first substrate carrier with the first substrate to asecond magnetic levitation track positioned on a top surface of thetransfer chamber, wherein the second magnetic levitation track is in afacing arrangement to the first magnetic levitation track. As set forthabove, the transfer chamber according to various embodiments herein maybe connected with at least one semiconductor process chamber, forexample, in a linear arrangement.

According to embodiments, the method 200 further can include optionally,at block 210, moving a second substrate through the transfer chamber.The moving 210 further can include, optionally at block 212, receivingthe second substrate by a second substrate carrier, wherein the secondsubstrate carrier is associated with the first magnetic levitationtrack. The moving 210 further can include moving the second substratecarrier with the second substrate along the first magnetic levitationtrack. Additionally or alternatively, the moving 210 further can includeat block 214 lifting with a second lift pin assembly the secondsubstrate carrier with the second substrate to the second magneticlevitation track.

According to embodiments, the receiving 212 can include removing thesubstrate from a semiconductor process chamber by the first substratecarrier. According to embodiments, method 200 can further includelifting 208 with the first lift pin assembly the first substrate carrierwith the first substrate and moving the second substrate carrier withthe second substrate along the first magnetic levitation track, whereinthe second substrate carrier positions the second substrate in thesemiconductor process chamber. In embodiments, the first substratecarrier can move in a first direction along a first track (e.g., thebottom track) and the second substrate carrier can move in a seconddirection along a second track (e.g., the top track). The first andsecond substrate carriers are able to pass each other without collision.

According to various embodiments, referring again to FIGS. 1A and 1B,during operation, a substrate (e.g., a wafer) positioned in the loadlock 107 can be removed in a first transfer plane from the load lock bya first substrate carrier 110. The first substrate carrier 110 havingthe substrate thereon can then move along a first track 112 in a firstdirection to a first process chamber 104F. If the first substratecarrier 110 is already in a transfer plane and the first process chamber104F is ready to receive the substrate, then the first substrate carrier110 positions the substrate in the first process chamber 104F. If thefirst substrate carrier having the substrate thereon is not in atransfer plane, then the first substrate carrier can be positioned abovea first lift pin assembly 128 proximate the first process chamber 104F.The first lift pin assembly 128 can lift the substrate carrier 110having the substrate thereon into the transfer plane where the firstsubstrate carrier places the substrate in the first process chamber 104Fwhen the first process chamber 104F is ready to receive the substrate.The first substrate carrier 110 is now free to collect another substrateeither from the load lock 107 or from another process chamber 104,104A-104E, 104G-104K.

In embodiments, the first substrate carrier 110 may be lifted to thesecond track 114 by the first lift pin assembly 128 and, for example,returned in a second direction to the load lock 107 to collect anothersubstrate. Alternatively, the substrate carrier may be lowered by thefirst lift pin assembly 128 to the first track 112, unless the firstsubstrate carrier 110 is already engaged with the first track 112, wherethe first substrate carrier 110 can move along the first track 112 toanother process chamber 104A-104E, 104G-104K. In embodiments, thesubstrate carrier 110 can wait at the first process chamber 104F untilthe completion of the process step on the substrate. In embodiments, thesubstrate may then be transferred to a second process chamber 104B usingeither the first substrate carrier 110 or using a second substratecarrier 110A-110C. Moving substrates between process chambers and theload lock, between tracks, and in and out of transfer planes can berepeated as needed to provide continuous and efficient operation ofsubstrate processing. Once the substrate has been processed by allnecessary process steps in corresponding process chambers, the substratecarrier having the substrate thereon may be lifted to the second track114 and returned proximate to the load lock 107 along the seconddirection.

In embodiments, the load lock transfer plane may be below the secondtrack 114, so the substrate carrier having the substrate thereon may belowered by the lift pin assembly 128 to the transfer plane, which insome embodiments, may be even with the first track 112. According tocertain embodiments, the transfer chamber 102 may be connected to asingle load lock 107 or a plurality of load locks (not shown). Forexample, the transfer chamber may be connected to two load locks in avertical arrangement. In this configuration, a substrate carrier engagedwith the top track can be loaded into the upper load lock. In certainembodiments, the load locks may be in a side-by-side arrangement and thesubstrate carriers may be lifted or lowered to align with the transferplane.

The disclosure further relates to a method 300, as shown in FIG. 3 ,comprising at block 302 moving one or more substrates through a transferchamber according to embodiments described herein. The moving 302 caninclude at block 304 receiving a first substrate by a first substratecarrier, wherein the first substrate carrier is associated with a firstmagnetic levitation track according to embodiments herein.

At block 306 the method 300 can include receiving by a first lift pinassembly the first substrate carrier with the first substrate and movingthe first substrate carrier with the first substrate to a secondsubstrate transfer plane. Method 300 further can include, optionally atblock 308, moving a second substrate on a second substrate carrier inthe first substrate transfer plane. A magnetic field may be activated inthe bottom track to secure the second substrate carrier to the toptrack. At block 310, method 300 further can include, optionally moving asecond substrate on a second substrate carrier in the first substratetransfer plane.

According to embodiments, methods herein can include detecting theposition of each of the substrate carriers and transporting them alongand between each of the first and second magnetic levitation tracks. Asthe substrate carriers move along the magnetic levitation tracks, liftpin assemblies can lift and lower the carriers between the tracks. Thisconfiguration enables flexible movement of substrates between processchambers and between process chambers and the at least one load lock.This flexibility coupled with the relatively small footprint of thetransfer chamber increases wafer throughput in an electronic deviceprocessing system.

The disclosure further relates to a method 400, as shown in FIG. 4 , formoving one or more substrates in a transfer chamber, comprising at block402, retrieving a first substrate from a load lock by a first substratecarrier engaged with a first magnetic levitation track positionedproximate to a bottom surface of the transfer chamber, wherein the firstmagnetic levitation track has a face-up orientation configured togenerate a first magnetic field above the first magnetic levitationtrack. At block 404 the method further includes generating the firstmagnetic field by the first magnetic levitation track to move the firstsubstrate carrier with the first substrate in a first direction alongthe first magnetic levitation track. At block 406, the method furtherincludes lifting, with a first lift pin assembly, the first substratecarrier with the first substrate to a second magnetic levitation trackpositioned proximate to a top surface of the transfer chamber, whereinthe second magnetic levitation track has a face-down orientationconfigured to generate a second magnetic field below the first magneticlevitation track. According to embodiments, the method further includesat block 408 detecting that the first substrate carrier is proximate tothe second magnetic levitation track. In embodiments, the method furtherincludes generating the second magnetic field to suspend the firstsubstrate carrier below the second magnetic levitation track and to movethe first substrate carrier with the first substrate in a seconddirection along the second magnetic levitation track.

The preceding description sets forth numerous specific details such asexamples of specific systems, components, methods, and so forth, inorder to provide a good understanding of several embodiments of thepresent invention. It will be apparent to one skilled in the art,however, that at least some embodiments of the present invention may bepracticed without these specific details. In other instances, well-knowncomponents or methods are not described in detail or are presented insimple block diagram format in order to avoid unnecessarily obscuringthe present invention. Thus, the specific details set forth are merelyexemplary. Particular implementations may vary from these exemplarydetails and still be contemplated to be within the scope of the presentinvention.

Although the operations of the methods herein are shown and described ina particular order, the order of the operations of each method may bealtered so that certain operations may be performed in an inverse orderor so that certain operation may be performed, at least in part,concurrently with other operations. In another embodiment, instructionsor sub-operations of distinct operations may be in an intermittentand/or alternating manner.

It is to be understood that the above description is intended to beillustrative, and not restrictive. Many other embodiments will beapparent to those of skill in the art upon reading and understanding theabove description. The scope of the invention should, therefore, bedetermined with reference to the appended claims, along with the fullscope of equivalents to which such claims are entitled.

We claim:
 1. A transfer chamber for an electronic device processingsystem, comprising: a first magnetic levitation track disposed withinthe transfer chamber, wherein the first magnetic levitation track has aface-up orientation configured to generate a first magnetic field abovethe first magnetic levitation track; a second magnetic levitation trackdisposed within the transfer chamber spaced apart from the firstmagnetic levitation track, wherein the second magnetic levitation trackhas a face-down orientation configured to generate a second magneticfield below the second magnetic levitation track; and at least oneassembly configured to move a plurality of substrate carriers in avertical direction between the first magnetic levitation track and thesecond magnetic levitation track, wherein the at least one assembly ispositioned along the first magnetic levitation track.
 2. The transferchamber of claim 1, wherein the at least one assembly comprises at leastone lift pin assembly.
 3. The transfer chamber of claim 1, wherein thetransfer chamber has only a single magnetic levitation track disposed ata first height within the transfer chamber and only a single magneticlevitation track disposed at a second height within the transferchamber, wherein the first magnetic levitation track is disposed at thefirst height within the transfer chamber and the second magneticlevitation track is disposed at the second height within the transferchamber.
 4. The transfer chamber of claim 1, further comprising aplurality of substrate carriers configured to move along the firstmagnetic levitation track and the second magnetic levitation track,wherein each substrate carrier of the plurality of substrate carrierscomprises a first magnet on a bottom of the substrate carrier tointeract with the first magnetic field and a second magnet on a top ofthe substrate carrier to interact with the second magnetic field.
 5. Thetransfer chamber of claim 1, wherein the transfer chamber comprises aplurality of ports, and wherein each of the plurality of ports isconfigured to permit access to a process chamber.
 6. The transferchamber of claim 5, further comprising an additional port configured topermit access to a load lock, wherein the additional port is disposed ata first end of the transfer chamber along the width of the transferchamber.
 7. The transfer chamber of claim 5, wherein the plurality ofports are a plurality of slit valves, wherein a first transfer plane ofat least a first subset of the plurality of slit valves is accessible tosubstrate carriers of the plurality of substrate carriers that areengaged with the first magnetic levitation track.
 8. The transferchamber of claim 1, wherein the first magnetic levitation track isconfigured to move one or more of the plurality of substrate carriers ina first direction along a length of the transfer chamber, and whereinthe second magnetic levitation track is configured to move one or moreof the plurality of substrate carriers in a second direction along thelength of the transfer chamber, wherein the second direction is oppositethe first direction.
 9. The transfer chamber of claim 1, wherein asubstrate carrier of the plurality of substrate carriers comprises anend effector for holding a substrate, wherein at least one of the firstmagnetic levitation track or the second magnetic levitation track isconfigured to cause the substrate carrier to rotate to place thesubstrate into a process chamber.
 10. The transfer chamber of claim 1,comprising a plurality of assemblies configured to move the plurality ofsubstrate carriers in a vertical direction, wherein the plurality ofassemblies are positioned along the first magnetic levitation track. 11.A method of moving one or more substrates through a transfer chamber,comprising: retrieving a first substrate by a first substrate carrier,wherein the first substrate carrier is associated with a first magneticlevitation track, the first magnetic levitation track disposed withinthe transfer chamber, wherein the first magnetic levitation track has aface-up orientation configured to generate a first magnetic field abovethe first magnetic levitation track; moving the first substrate carrierwith the first substrate along the first magnetic levitation track froma first location to a second location; and moving the first substratecarrier with the first substrate via at least one assembly in a verticaldirection from the first magnetic levitation track to a second magneticlevitation track, the second magnetic levitation track disposed withinthe transfer chamber spaced apart from the first magnetic levitationtrack, wherein the second magnetic levitation track has a face-downorientation configured to generate a second magnetic field below thesecond magnetic levitation track, wherein the at least one assembly ispositioned at the second location along the first magnetic levitationtrack.
 12. The method of claim 11, wherein the at least one assemblycomprises at least one lift pin assembly.
 13. The method of claim 11,wherein the transfer chamber has only a single magnetic levitation trackdisposed at a first height within the transfer chamber and only a singlemagnetic levitation track disposed at a second height within thetransfer chamber, wherein the first magnetic levitation track isdisposed at the first height within the transfer chamber and the secondmagnetic levitation track is disposed at the second height within thetransfer chamber.
 14. The method of claim 11, further comprising aplurality of substrate carriers configured to move along the firstmagnetic levitation track and the second magnetic levitation track,wherein each substrate carrier of the plurality of substrate carrierscomprises a first magnet on a bottom of the substrate carrier tointeract with the first magnetic field and a second magnet on a top ofthe substrate carrier to interact with the second magnetic field. 15.The method of claim 11, wherein the transfer chamber comprises aplurality of ports, and wherein each of the plurality of ports isconfigured to permit access to a process chamber.
 16. The method ofclaim 11, further comprising an additional port configured to permitaccess to a load lock, wherein the additional port is disposed at afirst end of the transfer chamber along the width of the transferchamber.
 17. The method of claim 11, wherein the first magneticlevitation track is configured to move one or more of the plurality ofsubstrate carriers in a first direction along a length of the transferchamber, and wherein the second magnetic levitation track is configuredto move one or more of the plurality of substrate carriers in a seconddirection along the length of the transfer chamber, wherein the seconddirection is opposite the first direction.
 18. The method of claim 11,wherein a substrate carrier of the plurality of substrate carrierscomprises an end effector for holding a substrate, wherein at least oneof the first magnetic levitation track or the second magnetic levitationtrack is configured to cause the substrate carrier to rotate to placethe substrate into a process chamber.
 19. The method of claim 11,comprising a plurality of assemblies configured to move the plurality ofsubstrate carriers in a vertical direction, wherein the plurality ofassemblies are positioned along the first magnetic levitation track. 20.A semiconductor processing system, comprising: a process chamber; and atransfer chamber in fluid communication with the process chamber, thetransfer chamber comprising: a first magnetic levitation track disposedwithin the transfer chamber, wherein the first magnetic levitation trackhas a face-up orientation configured to generate a first magnetic fieldabove the first magnetic levitation track; a second magnetic levitationtrack disposed within the transfer chamber spaced apart from the firstmagnetic levitation track, wherein the second magnetic levitation trackhas a face-down orientation configured to generate a second magneticfield below the second magnetic levitation track; and at least oneassembly configured to move a plurality of substrate carriers in avertical direction between the first magnetic levitation track and thesecond magnetic levitation track, wherein the at least one assembly ispositioned along the first magnetic levitation track.